講師：Prof.Luca Magagnin (ミラノ工科大学)
問い合わせ: 白鳥世明 (email@example.com)
Title “Metallization for flexible and stretchable devices”
Abstract: Electronic systems on flexible and stretchable substrates have received increasing attention in the last couple of decades because they enable classes of applications that lie outside of those easily addressed with wafer-based electronics. Different approaches can be followed to achieve the fabrication of the circuits directly on the flexible substrates. In this work, some of the activities performed by our research group in this field will be presented and discussed. Electroless plating and electrodeposition on flexible and stretchable substrates, fluorinated or not, will be described, underlining the different activation processes for the substrates and their influence in promoting the adhesion of the metallic layer. Together with the metallization process, a design of the metallic pattern to achieve stretchability and an in situ mechanical characterization will be shown. The combination of this metallization processes with inkjet technology and 3D printing additive manufacturing will be introduced.